New Scientific Publication

"Hexagonal Boron Nitride on Liquid and Single-Crystal Copper: Operando X-Ray and Atomistic Insights into Growth and Interfacial Structure"

Abstract

Two-dimensional (2D) hexagonal boron nitride (hBN) is a key dielectric for van der Waals nanoelectronics, however, its controlled synthesis by chemical vapor deposition remains challenging and poorly understood. In this context, the growth of hBN on liquid metal catalysts is promising, as the atomically flat liquid surfaces are assumed to promote high-quality 2D growth, an expectation largely informed by graphene. Here, we implement an involved operando methodology to monitor and quantify hBN growth on molten copper (Liq-Cu) and re-solidified single-crystal copper (SC-Cu) under near-ambient-pressure conditions, enabling real-time identification of growth stages, morphology, and interfacial structure. Contrary to expectation, Liq-Cu promotes multilayer and three-dimensional domain formation, whereas SC-Cu predominantly yields monolayer-limited growth. This substrate-phase dependence correlates with a larger adsorption height of hBN on Liq-Cu than on SC-Cu, as determined by X-ray reflectivity and supported by machine-learning-accelerated molecular dynamics simulations. Direct comparison with graphene on Cu further reveals a distinct directional bonding character at the hBN/Cu interface, which rationalizes the observed adsorption-height trends. More generally, these trends across 2D materials and substrates identify the resulting interfacial stabilization – together with macroscopic factors such as precursor solubility – as a key design parameter governing mono- versus multilayer growth in 2D material synthesis.

Article ID: ADVS76354
Article DOI: 10.1002/advs.76354
Internal Article ID: 100607907

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SUMMARY OF THE PROJECT AND MAIN RESULTS

The 2D ENGINE project looks for 2D semiconductor and dielectric materials which cannot be exfoliated from bulk but they need to be engineered as atomically thin films using chemical vapor deposition on metal catalyst substrates or on melted surfaces. The semiconducting materials are envisaged to have the outstanding stability of graphene and offer excellent electrostatic control in digital electronic devices which allows their miniaturization and their operation with superb energy efficiency. The project mobilizes diverse expertise in materials science and engineering, materials growth, condensed matter physics, atomistic simulation, in-situ surface characterization techniques, equipment development, semiconductor processing and electrical engineering to face the challenges.

We envision that our atomically thin semiconductor channels combined with ultrathin dielectrics, will form the next generation of the multisheet gate-all-around field effect transistor (GAAFET) architectures. It is expected that the 2D ENGINE devices will have an impact on the efforts for chip miniaturization according to the requirements of future aggressively scaled 2 nm technology nodes. Moreover, 2D ENGINE targets the integration of 2D light emitting diode (LED) devices with planar waveguides to increase the efficiency of silicon photonic integrated circuits (PIC) for low power on-chip communications.

The envisaged free-standing wafer scale 2D semiconductors and dielectrics are expected to be transferable so they could offer innovative solutions for the integration of power devices on the back-side of the wafer with the aim to decouple the power delivery network from the signal (logic) network on the front side of the wafer.

 

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2D ENGINE consortium has realized ultrathin layers of semiconductor and dielectric materials

2D ENGINE consortium has realized ultrathin layers of semiconductor and dielectric
materials using liquid metal catalyst growth, greatly assisted by in-situ, real time
monitoring tools developed partly within the project.

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